Smiths Interconnect

EMC & RF Labs are now Smiths Interconnect

Learn More >

Chip Attenuators TS05 Wire Bond Gold Series

EMC Technology’s TS05 chip attenuators have a rated input power of 100 milliwatts with attenuation values from 0 dB to 20 dB and work from DC to 12.4 GHz.  Platinum gold metallization wraps around ground terminal only. Full backside metallization and input and output terminals have gold metallization for wire bonding applications.

TS05XXWB1 Specification Sheet

Wire Bond Gold TS05 Packaging Specifications



Size 1.55mm x 1.91mm [0.061in x 0.075in]
Impedance 50 Ohms
Frequency Range DC to 12.4 GHz
VSWR (Typical) 1.30
Power Rating 100 Milliwatts
Operating Temperature -55°C to 150°C
Substrate Alumina
Resistive Material Thin Film
Terminal Material Thick Film, Nickel Barrier with Solder Plate or RoHS, Gold or Wire Bondable Options Available