High Reliability Chip Attenuators HR03 Triple Wrap Series
The HR W3 version fixed attenuator which offers metallization wraps around input, output, and ground terminals with small contact pads on the backside. The process permits inspectable solder fillets when flip chip mounting. Our application notes describes the mounting techniques to optimize RF performance, heat sinking, and mechanical support terminals for use with alternative high frequency attachment methods and space applications. This product is available with various plating options including 60/40 low temperature solder plating or 60/40 solder fused finish for easy reflow processing.
HR03-W3 Specification Sheet
HR03-W3S Specification Sheet