EMC Technology Florida RF Labs

High Reliability Chip Attenuators HR03 Wire Bond Gold Series

The series HR WB1 version of the Thermopad offers wire bondable terminals for use with alternative high frequency attachment methods and space applications.

HR03-WB1 Specification Sheet


Product Selection Table

 
PowerFrequencydB ValueVSWRLengthWidthHeightPart #
2631.50.1450.1230.021HR0303AWB1
26111.50.1450.1230.021HR0311AWB1
26191.50.1450.1230.021HR0319AWB1
2601.50.1450.1230.021HR0300AWB1
2611.50.1450.1230.021HR0301AWB1
2621.50.1450.1230.021HR0302AWB1
2671.50.1450.1230.021HR0307AWB1
2641.50.1450.1230.021HR0304AWB1
2651.50.1450.1230.021HR0305AWB1
2661.50.1450.1230.021HR0306AWB1
2681.50.1450.1230.021HR0308AWB1
2691.50.1450.1230.021HR0309AWB1
26101.50.1450.1230.021HR0310AWB1
26151.50.1450.1230.021HR0315AWB1
26121.50.1450.1230.021HR0312AWB1
26131.50.1450.1230.021HR0313AWB1
26141.50.1450.1230.021HR0314AWB1
26161.50.1450.1230.021HR0316AWB1
26171.50.1450.1230.021HR0317AWB1
26181.50.1450.1230.021HR0318AWB1
26201.50.1450.1230.021HR0320AWB1