CVD Diamond chip terminations offer a unique combination of extreme high power ratings in very small packages. These terminations may be used in applications from DC to 28.0 GHz and are ideal for applications with requirements for high power capability, broad frequency response, small footprint and light-weight. The terminations are manufactured using all thin film construction and have a gold finish that is both wire bondable and solderable. This total thin film construction also makes them ideal for peak power applications. High reliability tested versions per Mil-PRF-55342 are also available. Select from tape and reel, bulk, or waffle packaging. These products are also lead free, RoHS compliant and S-level approved.