EMC Technology Florida RF Labs

HybriX® Wire Bonding Island

Wire bonding islands are an alternative to long wire connectors between components, which produce inductance in the circuit. They offer a location to wire bond without plating the entire PC board with gold. By mounting a wire bonding island between two components being wired together, shorter wire leads may be used, reducing overall parasitics in the circuit. They offer the option of using a tab for easy connection to a circuit. Standard thickness is .015 inches (.38mm). Contact the sales department for other thicknesses.

Wire Bonding Island Specification Sheet

Product Selection Table

 
LengthWidthHeightPart #
.050.070.015W050-070
.100.100.015W100-100
.050.100.015W050-100
.060.080.015W060-080
.060.140.015W060-140
.100.100.010W100-100-10
.050.070.010W050-070-10
.050.100.010W050-100-10
.060.080.010W060-080-10
.060.140.010W060-140-10