High Reliability Mini Thermopads® Triple Wrap Series
The HRM W3 version Thermopads®
offer metallization wrap around input, output, and ground terminals with small contact pads on the backside. The process permits inspectable solder fillets when flip chip mounting. Our application notes describes the mounting techniques to optimize RF performance, heat sinking, and mechanical support terminals for use with alternative high frequency attachment methods and space applications. This product is available with various plating options including 60/40 low temperature solder plating or 60/40 solder fused finish for easy reflow processing. Parts may be ordered 100% tested to Group A with the option to add Group B or Group C.
HRM-W3 Specification Sheet
HRM-W3S Specification Sheet